Develops creative solutions to challenging micromachining problems, using precision diamond dicing blades and lasers to cut and machine a variety of hard brittle materials.

Supplier of test reticles and related services used by leading chip makers and equipment manufacturers, also providing conventional and gray scale CAD design, photo mask and imprint template sourcing, wafer fabrication and supply-chain development.

Offers a broad and growing portfolio of innovative material technologies for semiconductor packaging and circuit materials.

Provides high quality silicon wafers and wafer services to the semiconductor industry.

Specializes in the development of high quality, specialty, compound semiconductor materials.

Stocking distributor of ceramic packaging materials for microelectronic IC assembly.

Specializes in device quality thin film deposition, and confidential research and development processing.

Distributor of silicon wafers and provider of silicon wafer services for the semiconductor industry, supplying silicon wafers custom made in a variety of diameters and grades.

Supplier of various oxides, metals, alloys, advanced ceramic materials, and minerals.